New SMT Equipment: component spacings (Page 10 of 50)

Flex PCB 1

Flex PCB 1

New Equipment | Printing

1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.

PingYork Technology & Resources Inc

8 layers PCB with BGA and golden fingers

8 layers PCB with BGA and golden fingers

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

CYZON LIMITED

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

4 Layers Rogers pcb

4 Layers Rogers pcb

New Equipment | Assembly Services

4 layer PCB Material: Rogers 5880 Finished Thickness :2.0 mm; Copper thickness : 1OZ finished ; Surface finishing: Immersion Tin Min Via hole size :0.30mm; Min Trace width/ spacing : 0.13 mm / 0.13 mm

YOUNG HE ELECTRONIC TECHNOLOGY CO.,LIMITED

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

HEPCO DIP Lead Cutters

HEPCO DIP Lead Cutters

New Equipment | Lead Forming

C7600 Convertible Cutter One Machine for .300", .400" and .600" DIPs Fast, Simple Conversion Fixed Blades for Reliability & Accuracy Comes with Complete Conversion Kit Including Guides, Blades and Allen Drivers Ideal for Lower Volume Manufact

HEPCO, Inc.

Ceramic Disc Capacitors

Ceramic Disc Capacitors

New Equipment | Components

Body insulation - conformal coating Standard max. coating on leads is .125"; closer control is optional at extra cost. Marking - Trademark, Cap, Tol., T.C., and Voltage (Voltage omitted on 500V). Special disc products are also available fr

TUSONIX, Inc.

SMT Mini Stencils / PCB Rework Stencils

SMT Mini Stencils / PCB Rework Stencils

New Equipment | Solder Paste Stencils

Stentech produces mini stencils; small stencils that are used mainly for BGA re-work. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and ape

Stentech

Impedance control PCB

Impedance control PCB

New Equipment | Components

Bicheng provides impedance controlled PCB's for R&D, high-tech, IT research companies and organizations, large or small. Technical parameters *Controlled dielectric            *Controlled impedance            *Design coupons  *Test coupons *Po

Bicheng Enterprise Company


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