New Equipment | Test Equipment
Sinic Tek 3D SPI Machine S450 3D SPI PCB size:50x60-330x330mm weight:850KG Dimension:850x1430x1500mm Product description: Sinic Tek 3D SPI Machine S450, , Automatic online solder paste inspection system, PCB size:50x60-330x330mm, weight:850
3D SPI Machine S450 Dual lane AOI PCB size:50x60-330x330mm Dimension:850x1430x1500mm weight:850KG Product description: 3D SPI Machine S450 INQUIRY 3D SPI Machine S450 Specifications: Product’s parameters: 1.Solder p
New Equipment | Test Equipment
Sinic Tek 3D SPI Machine S450 Dual lane AOI PCB size:50x60-330x330mm Dimension:850x1430x1500mm weight:850KG Product description: Sinic Tek 3D SPI Machine S450 Sinic Tek 3D SPI Machine S450 Specifications: Product’s parameter
New Equipment | Test Equipment
Sinic Tek 3D SPI Machine S450 3D SPI PCB size:50x60-330x330mm weight:850KG Dimension:850x1430x1500mm Product description: Sinic Tek 3D SPI Machine S450, , Automatic online solder paste inspection system, PCB size:50x60-330x330mm, weight:850
Sinic Tek 3D SPI Machine S450 Dual lane AOI PCB size:50x60-330x330mm Dimension:850x1430x1500mm weight:850KG Product description: Dual lane AOI，PCB size:50x60-330x330mm，Dimension:850x1430x1500mm，weight:850KG INQUIRY Sinic Tek 3D
Offline Selective Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG weight 380KG dimension L1280mm X W1400mm X H1650mm Product description: Offline Selective Soldering Machine, max solder temperature 350℃ solder pot capa
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New Equipment | Wave Soldering
Offline Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm Net weight 380KG Product description: Offline Selective Wave Soldering Machine max solder temperature 350℃ sol
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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