New SMT Equipment: components flip in oven (Page 1 of 1)

PTI-500 First Article Inspection Tester

PTI-500 First Article Inspection Tester

New Equipment | Inspection

PTI-500 First Article Inspection Tester 版本号:PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be

Qinyi Electronics Co.,Ltd

Specialists in Process Heat

New Equipment |  

Design, construction, installation of industrial process heating systems. Ovens, furnaces, propane systems, multi fuel burner conversions, fume incinerators, fuel storage, process equipment, metal treating furnaces, control systems and panels, heat

Chesmont Engineering Company Inc

BIRAL BIO-30  (Biral Industrial Oil) Operates to +300°C. Supplied in 1/5/20/200 liter cans/drums.

BIRAL BIO-30 (Biral Industrial Oil) Operates to +300°C. Supplied in 1/5/20/200 liter cans/drums.

New Equipment |  

BIRAL BIO-30 is an extremely high quality fully synthetic industrial oil for a wide variety of applications BIRAL BIO-30 leaves no carbon deposits and is highly oxidation resistant. BIRAL BIO-30 is an outstanding lubricant for oven conveyors

BIRAL USA, ADVANTAGE DIST., LLC

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

New Equipment | Materials

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to

Zymet, Inc

Big-Size Vacuum Soldering Oven  for IGBT, MOS

Big-Size Vacuum Soldering Oven for IGBT, MOS

New Equipment | Solder Materials

              Big-Size Vacuum Soldering Oven  for IGBT, MOS 1.Reflow soldering   Typically high number of voids cause a large non conductive area 2.Vacuum soldering  Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid

Beijing Chengliankaida Technology Co.,Ltd

High Quality Vacuum  Reflow Soldering Oven KD-V43 with 100% Hydrogen, Nitrogen Or  Hydrogen Forming gas ,HCOOH

High Quality Vacuum Reflow Soldering Oven KD-V43 with 100% Hydrogen, Nitrogen Or Hydrogen Forming gas ,HCOOH

New Equipment | Soldering - Other

Sunny Company:Beijing Chengliankaida Technology Co.,Ltd  Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China  Email: salemachines@bjclkdkj.cn  Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496  

Beijing Chengliankaida Technology Co.,Ltd

Reflow Oven with Integrated Vacuum Soldering KD-V43  for IGBT, BGA

Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA

New Equipment | Soldering - Other

Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China  Email: salemachines@bjclkdkj.cn  Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496 ​

Beijing Chengliankaida Technology Co.,Ltd

Anisotropically Conductive Adhesives

Anisotropically Conductive Adhesives

New Equipment | Materials

For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and

Zymet, Inc

  1  

components flip in oven searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Thermal Interface Material Dispensing

High Precision Fluid Dispensers
Circuit Board, PCB Assembly & electronics manufacturing service provider

Wave Soldering 101 Training Course