New Equipment | Test Equipment
The Energy Dispersive X-Ray Fluorescence Analysis (ED-XRFA) is a method for measuring the thickness of coatings and for analyzing materials. It can be used for the qualitative and quantitative determination of the elemental composition of a material
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture wave solder carriers for open aperture and selective soldering process. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture print, place, reflow carriers. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
As a Worldwide Premier Electronic Contract Manufacturer, Tropical Assemblies Manufactures a wide range of High Tech RF/Wireless and Complex Electronic Products for a variety of industries. Including Medical, Avionics and Telecommunications Tropical
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
Our products had been widely used in mechanical and electronic industries, etc. Our main products include: 1. Synthetic Stone(the same quality of Durostone material): with black, gray, blue and red colors, etc. 2. Glass Fibre board: 3241 semiconduct
The excellent performance and versatility of Permabond's cyanoacrylate adhesives have eliminated many product design and production limitations. Permabond manufactures a full spectrum of cyanoacrylates. Our chemists have perfected this line to perfor
Job Purpose Develop the next generation, leading edge products for GE Energy customers. As an Advanced Manufacturing Engineer supporting Gas Turbines, you will: Work in a highly cross-functional environment with Engineering, Manufacturing, Sourcing
Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
