New Equipment | Solder Materials
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UM
Automotive headliners (www.sun-tec.ch)containing LEDs may be produced by integrating LED Chains behing perforated composite headliners. This very time consuming handwork may be substituted integrating SUN-TEC LED embedded Films into the headliners co
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Solder Materials
Galvanite solder is a lead-free formulation designed specifically for high quality repairs to galvanized steel surfaces. Galvanite is simple, effective and easy to use, in both manufacturing and field applications. Just like the original galvanizing,
New Equipment | Solder Materials
Galvanite solder is a lead-free formulation designed specifically for high quality repairs to galvanized steel surfaces. Galvanite is simple, effective and easy to use, in both manufacturing and field applications. Just like the original galvanizing,
New Equipment | Solder Materials
Galvanite solder is a lead-free formulation designed specifically for high quality repairs to galvanized steel surfaces. Galvanite is simple, effective and easy to use, in both manufacturing and field applications. Just like the original galvanizing,
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
New Equipment | Test Equipment
The Energy Dispersive X-Ray Fluorescence Analysis (ED-XRFA) is a method for measuring the thickness of coatings and for analyzing materials. It can be used for the qualitative and quantitative determination of the elemental composition of a material
High performance composite materials specifically designed for the PCB assembly process Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT r
Parmod�, Parelec Inc�s patented conductive ink technology, enables the formation of continuous-phase pure metallic conductors at relatively low temperature�making them suitable for application to polymer substrates. Parmod� inks, pastes and toners ca
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