When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
website http://www.fongyong.com.tw Established in 1983, Fong Yong Chemical Co., Ltd. is professional manufacturer for Epoxy resins, PU resin, silicone compounds, UV curing resin series, Anaerobic locking agent resin series, Lubricant series and insta
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
extruder gun 1.using in the operation of T2 compound A and T2 compound B ，heats, softens and extrudes rope rubber. 2.mainly used in conveyor belt repair of scratches, tear, perforation. 3.Technic parameter: Rated input power:850w Operating temperat
New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
New Equipment | Surface Finish
The Minilock-Phantom is the first RIE system in the industry to incorporate a vacuum load-lock on a compact platform. The system has been designed to meet all the safety and equipment needs for the most challenging processes including etch applicatio
Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
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