New SMT Equipment: compound (Page 3 of 4)

Albendazole

New Equipment | Other

Albendazole CAS no. 54965-21-8 is an organic compound having Mol . formula C12 H15 N3O2S , mol. Wt 265.33 gm. /mol. is a white to off white powder form. It is associated with the family of Benzimidazole and hence an important derivative of Benzimidaz

Lasa Laboratory Pvt Ltd

UV-3010 UV Curable Conformal Coating / Encapsulant

UV-3010 UV Curable Conformal Coating / Encapsulant

New Equipment | Materials

Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h

Conductive Compounds, Inc.

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

New Equipment | Materials

EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle

Conductive Compounds, Inc.

Katronic Technologies Ltd

New Equipment |  

The portable FLUXUS� ADM 6725 flowmeter from Katronic Technologies utilises ultrasonic technology for accurate energy efficiency measurement across a wide range of industries. Climate Change Levy The introduction of the Climate Change Levy will cost

Katronic Technologies Ltd

Thermodime - Diamond Interface Material

Thermodime - Diamond Interface Material

New Equipment |  

Thermodime� diamond heat transfer compound from Electrospell is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals suspended in a special carrier fluid. The product comes in a 1 ml sy

Electrospell

Electronic & Engineering Materials

Electronic & Engineering Materials

New Equipment | Materials

In many cases the casting process is carried out under a vacuum to prevent air pockets. Trapped air bubbles reduce heat dissipation, since air is a good heat insulator, or they give rise to disruptive electrical charges in high-voltage applications,

ELANTAS Electrical Insulation

HTC - 300 High Temperature Carbon Ink for Screen Printing in Flex Circuits

HTC - 300 High Temperature Carbon Ink for Screen Printing in Flex Circuits

New Equipment | Materials

HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo

Conductive Compounds, Inc.

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

AQUANOX® A4241 - Solution for PCB & Stencil Cleaning

AQUANOX® A4241 - Solution for PCB & Stencil Cleaning

New Equipment | Cleaning Agents

AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p

KYZEN Corporation


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