3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
The Viscom S3088 CCI checks for the completeness of conformal coating on PCBs, and is intelligently linked to other inspection gates from Viscom. Reliable, precise detection of coating voids. Transparent conformal coating protects electronics assem
New Equipment | Cable & Wire Harness Equipment
Overview The ToolingShuttle 30 combines the crimp applicator (tooling), terminal reel and paper winder into one mobile quick-change unit for CrimpCenter 3-series fully automatic crimping machines. The ToolingShuttle 30 allows the operator to exchan
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Caters effectively to a wide range of production processes - it is also the world's fastest in its class. Caters effectively to a wide range of production processes – it is also the world’s fastest in its class Note: components mounting speed (CP
New Equipment | Test Equipment
Rohde & Schwarz SFU Broadcast Test System with options B10, B2, B3, B4, B6, B11, B30 & K1, K15, K20, K21, K22, K30, K35, K27, K40, K41, K42, K43, K60, K80, K191, K193, K199, K354, & DV-DVBH The R&S SFU is the all-in-one solution for broadcast and m
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
SCALABLE, COST-EFFECTIVE SOLUTION FOR HIGH-MIX & NPI Combines the capability, flexibility, and reliability you expect from Panasonic’s award-winning NPM and PanaCIM® Manufacturing Execution System (MES) into a cost-effective, high-mix solution. T
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