New SMT Equipment: conditioning (Page 17 of 22)

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

MegaStrip 9650 Automatic Cut & Strip Machine

MegaStrip 9650 Automatic Cut & Strip Machine

New Equipment | Cable & Wire Harness Equipment

Overview The MegaStrip 9650 is a modularly designed, automatic cut and strip machine for processing single core wires, multiconductor cables and shielded cables up to 35 mm (1.38") in outer diameter. The machine is available in 2 basic versions and

Schleuniger, Inc.

Panasonic BM Series PCB Placement Equipment

Panasonic BM Series PCB Placement Equipment

New Equipment | Pick & Place

General purpose placement with tape, tray and stick inputs. 30,000 cph. 120-160 8mm reels. A wide range of component, quick changeover capabilities Ensures continuous productivity by placing components from (01005”) 0402* to L 55 mm × W 55 mm or

Panasonic Factory Solutions Company of America (PFSA)

Panasonic SPG Screen Printer

Panasonic SPG Screen Printer

New Equipment | Printing

Lean, high speed, screen printing. Adaptable to dual lane for faster production, the Panasonic SPG can also handle large boards. A great companion for the AM100 Placement Machine Panasonic's SPG high-speed screen printing machine is the ultimate

Panasonic Factory Solutions Company of America (PFSA)

Panasonic SP70 Screen Printer

Panasonic SP70 Screen Printer

New Equipment | Printing

Ultra-high accuracy screen printing Panasonic's SP70 screen printer is designed for both high- and low-volume manufacturers who require ultra-high printing accuracy. PCBs up to 580 x 508mm are processed in a smaller footprint than previous SP-serie

Panasonic Factory Solutions Company of America (PFSA)

Yamaha YSP20 Dual-stage, Dual-stencil Printer

Yamaha YSP20 Dual-stage, Dual-stencil Printer

New Equipment | Printing

Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time

Yamaha Motor IM America, Inc.

MEGARIDER™ Reflow Oven Analysis Test Boards

MEGARIDER™ Reflow Oven Analysis Test Boards

New Equipment | Reflow

The MEGARIDER™ family helps you to know more about the behavior of your oven. Use them to characterize for development, verify for production, or qualify pre-purchase. Equal masses across the width of the boards, permit PCB-like profiles that give in

Electronic Controls Design Inc. (ECD)

Coplanarity Service / Lead Straightening

Coplanarity Service / Lead Straightening

New Equipment | Rework & Repair Equipment

Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles.  The goal of lead restoration is not to mimic "l

Process Sciences, Inc.

HITACHI GXH-3 Modular Mounter

HITACHI GXH-3 Modular Mounter

New Equipment | Pick & Place

Ridiculously high-speed placement with flexibility to handle larger components. A placement system with the ludicrous placement rate of 95000 cph, and flexibility to place components ranging from 0201(0603mm) chip to 100x26mm connector. Two in

Hitachi High Technologies America, Inc.

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix


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