New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
New Equipment | Coating Materials
High Reliability protective coatings for Electronics circuit assembly.Qualified under UL,IPC,MIL qualifications.Protection against Moisture,Humidity,Chemicals,Gases,Dust,Insects,Rodent refuse and many other pollutants. Used extensively in the Automo
Full size automated conformal coat inspection. Quick set-up with Auto Train™ 5 megapixel color imaging Proprietary Lighting Optional side angle cameras Conformal coatings used by electronic manufacturers contain UV indicators for
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. Quick set-up with Auto
Contract electronics design and manufacturing service provider specializing in advanced electronic products. ISO-9002 certified and IPC Class II and III capable. Advanced SMT packages including uBGA and 0201 components. Full testing, X-ray inspection
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
Design Assistance Printed Circuit Board Assembly Prototyping & New Product Introduction (NPI) High-mix/low-volume Medium-mix/medium-volume Electro-Mechanical Assembly Cable assembly Sub-assembly – i.e. Chassis assembly and wiring Full system assembly
Our manufacturing capabilities allow us to support all aspects of the electronics manufacturing process. Our production processes include: High speed continuous flow SMT lines. High Mix SMT and PTH. Automated PTH assembly. Fine Pitch, BGA, CSP, C
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
.png)