New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
GENESYS-PIN Hybrid 3D AOI Series MIRTEC's unique Hybrid 3D Technology Press-fit Pin, Single Pin, Pin Array, Fork Pin, Connector Pin Inspection 50㎜ height pin inspection SMD inspection is possible as well as pin inspection Mul
ProntoTEST-FIXTURE used by electronics manufacturers will accurately setup your Automatic Test Equipment (ATE), Flying Probe and design your "bed of nails" test fixturing. In minutes Unisoft ProntoTEST-FIXTURE software translates CAD and Bill of Ma
YAMAHA Refurbished YG100 Chip Mounter SMT Pick and Place Machine YAMAHA YG100 high-speed placement chip, high-precision, high-speed modular placement machine,high rigidity dual drive structure,High-performance servo system, high-resolution digital m
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S Feature ▶Phase measurement technology ▶Optocoupler measurement technology ▶Current measurement technology ▶Multiple points measurement ▶Isoelectric separation point automatically ▶High voltage detecting and discharging te
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Effective Solutions for any Odd-Form Application on any OEM Platform. Count On Tools has the experience and manufacturing flexibility to be able to develop custom engineered solutions to satisfy your individual Process Requirements. With over 20 y
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Board Handling - Conveyors
Description This equipment is used at the junction of the aisle of the production line to play the role of transmission and channel Features 1.Full closed design ensures safety level of operation. 2.Smooth and precise width adjustment (leadscrew)
