The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
New Equipment | Test Equipment
I.C.T A40 Flying Probe Tester: High-Speed, Precision PCB Inspection The I.C.T A40 Flying Probe Tester is an advanced inspection system designed for high-speed, precise analysis of manufacturing defects on assembled circuit boards. Leveraging cutting
We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.
Application TM240A is widely used in 1. small batch production 2. product sample trials 3. PCB&LED SMT processing 4. other similar processes It is ideal choice for small medium manufacturing enterprises and research laboratories! Applicable P
100% original manufacture delivery 100% the fastest delivery time 100% quality assurance 100% customer satisfaction Application TM240A is widely used in 1. small batch production 2. product sample trials 3. PCB&LED SMT processing 4. othe
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
Optimal Accuracy and High Placement Rate with ultra fine-pitch placers that delivers optimal accuracy for components ranging from 0201 chips to large connectors and odd form SMDs. Main Features and benefits: Total Component Range The Emerald-XII
