GENESYS-PIN Hybrid 3D AOI Series MIRTEC's unique Hybrid 3D Technology Press-fit Pin, Single Pin, Pin Array, Fork Pin, Connector Pin Inspection 50㎜ height pin inspection SMD inspection is possible as well as pin inspection Mul
YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE Model YG100RA(FNC TYPE )/YG100RB(SF TYPE) Object substrate L50×W50mm ～L510×W460mm Mounting efficiency 24000CPH/CHIP (
Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
YAMAHA Refurbished YG100 Chip Mounter SMT Pick and Place Machine YAMAHA YG100 high-speed placement chip, high-precision, high-speed modular placement machine,high rigidity dual drive structure,High-performance servo system, high-resolution digital m
ProntoTEST-FIXTURE used by electronics manufacturers will accurately setup your Automatic Test Equipment (ATE), Flying Probe and design your "bed of nails" test fixturing. In minutes Unisoft ProntoTEST-FIXTURE software translates CAD and Bill of Ma
Connectors is a device that connects two active devices to transmit currents or signals. Domestic connectors, known as the connector and socket, generally refers to electrical connectors. Essential performances of connectors and interconnects can be
Connector vision inspection machines 2D - 3D integration Coplanarity inspection Tube or tray input Tape and reel output
New Equipment | Education/Training
An 8 hour combined lecture, video and hands on session that includes: Soldering techniques for soldering wires to terminals including through-hole components. Identify the different types of solder terminals, connectors, and through hole compone
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
