Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig
2 units of Fuji GL541E Glue Dispencer, prod.2002, very good working condition, ready for inspection and shipment,for more info and quotation please contact
New Equipment | Cleaning Equipment
SM-8160 Ultrasonic Stencil Cleaner ,High pressure Spraying Stencil washing system Features : Patent design, close contacting ultrasonic combining with spray cleaning, the stencil is no need to dip into the tank The stencil moves up and down with
New Equipment | Board Handling - Storage
Manual Wand for Semiconductor Wafer Handling Handle a fragile semiconductor silicon wafer softly but firmly without excessive touch. The surfaces of a wafer are never scratched in contrast to conventional metal tweezres. Our unique design (Pat
ELECTRONIC MANUFACTURING SERVICES (www.sun-tec.ch) ON TEMPERATURE SENSITIVE MATERIALS: SUN-TEC has developed its own cold curing, solvent free contact glues to be able to pick and place SMD systems on heat sensitive substrates. That is why SUN-TEC's
iJet-Table Dispenser Model 250 & 350: SMT and PCB Packaging, Underfill, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the n
Underfill, FPC, Glob Top, Dam & Fill, Surface Mount Adhesive, LED Packaging, BGA Edge Bonding, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated. Viscosity Contr
