For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Cleaning Equipment
Digicom Electronics’ Diamond Track Cleaning Process, winner of the 2012 Global Technology Award, is a highly efficient, in-line cleaning system aimed at mitigating failures caused by contaminated PCBs. Our innovative Diamond Track Cleaning Process use
Burkert Valves are available in a wide range of types and sizes, and are the world technology leader with a product offering ranging from simple on-off applications to full process control and communication applications utilizing specific pneumatic a
Strata-Shield ENV� prevents ESD damage of all known categories during transportation and storage: Catastrophic failure Latent failure Mechanical damage Strata-Shield ENV� protects your ESDS in accordance with EN 61340-5-1: Low Charging Dissipative S
Strata-Shield ENV� prevents ESD damage of all known categories during transportation and storage: Catastrophic failure Latent failure Mechanical damage Strata-Shield ENV� protects your ESDS in accordance with EN 61340-5-1: Low Charging Dissipative S
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
New Equipment | Test Equipment
For over 40 years the Benchmark for Ionic Contamination Testing Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of
A membrane switch is an electrical switch for turning a circuit on and off. It differs from a mechanical switch, which is usually made of metal and plastic parts. A membrane switch is a circuit printed on a flexible material like Polyester or Polycar
Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
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