New SMT Equipment: convention (Page 1 of 18)

Laser Cutting Services

Laser Cutting Services

New Equipment | Other

Our Preco FlexPro CNC laser cutting system provides the speed of galvanometer processing with all the versatility of an XY motion system. Orion has the capability to cut detailed parts more precisely, and with shorter lead-times than conventional too

ORION Industries

IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard

New Equipment | Education/Training

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c

BEST Inc.

JUKI JM Series Hybrid Through-Hole Placement and Conventional SMT

JUKI JM Series Hybrid Through-Hole Placement and Conventional SMT

New Equipment | Pick & Place

JUKI’s revolutionary technology adds through-hole placement along with conventional SMT. Multi-Task Platform Achieve higher quality and labor savings by automating manual insertion. The JM100 / JM20 automates the manual insertion and clinch

Juki Automation Systems

Laser dicing (Synova Laser Microjet.)

Laser dicing (Synova Laser Microjet.)

New Equipment |  

The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p

American Precision Dicing, Inc.

Soldering Assembly Services

Soldering Assembly Services

New Equipment | Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar

S-Bond Technologies

Thermally Conductive Adhesives

Thermally Conductive Adhesives

New Equipment | Materials

For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi

Zymet, Inc

Powder Coating Melbourne

Powder Coating Melbourne

New Equipment | Other

Powder Coating- is a type of coating that is applied as a free-flowing, dry powder. The main difference between a conventional liquid paint and a powder coating is that the powder coating does not require a solvent to keep the binder and filler parts

DS Custom Toolboxes

Series 7000- Solid Value Workbench System

New Equipment |  

The Arlink 7000 system lets you tailor traditional workbenches to your needs while providing greater versatility than conventional workbenches.

ARLINK - Adaptable Workstation Sytems

Wafer Tweezers

Wafer Tweezers

New Equipment | Board Handling - Storage

Manual Wand for Semiconductor Wafer Handling Handle a fragile semiconductor silicon wafer softly but firmly without excessive touch. The surfaces of a wafer are never scratched in contrast to conventional metal tweezres. Our unique design (Pat

Fluoro Mechanic Co., Ltd.

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