Hanwha SM471 Plus pick and place machine Component Range:0402(01005 Patch speed 78,000 CPH 2 Gantry x 10 Spindles/Head weight 1820KG Product description: Hanwha SM471 Plus Pick and Place Machine,Component Range:0402 above, Patch speed 78,000 CPH,2 G
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS+ 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 25mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
New Equipment | Test Equipment
Hanwha SM471 Plus SMT Assembly Line Hanwha SM471 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:78000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
80 cm²/sec with zero compromise on measurement accuracy and repeatability. With SE500-D™ you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solde
Dual lane system with a multi-segment board capability The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors respond to floor-space constraints as well as AOI produ
New Equipment | Surface Finish
Surface Treatment: Cleans, Ablates, Promotes Adhesion Atmospheric plasma treatment is a unique technology for surface treatment in electronic assembly: Nano-Cleaning, Removal of Organic Contaminants, Surface Activation/Modification, Surface Ablation
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