New Equipment | Component Programming
Entry level desktop automation - the next step up from manual programming & duplication With a break-through in simplicity, the automated FLX family delivers blazing fast throughput in a desktop footprint. The FLX family eliminates human errors typi
New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
We offer vision based inspection equipment for lead and mark inspection of SOP components with true coplanarity
For devices which fail lead inspection, we also offer equipment that can correct pin to pin as well as standoff and coplanarity defects.
1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be
500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
Methods in accordance with PRO-STD-001, SAE AS 5553, and SAE AS 6081. Process follows ISO/DIS 12931. Datest tools and training are used to detect packaging damage; ESD compliance violations; falsified or altered documentation; tampered part markin
3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
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