New Equipment | Solder Materials
KappZapp3.5A Acid-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains an acidic flux. When the solder is heated, the flux is released and removes the oxide
New Equipment | Solder Materials
KappZapp3.5R Rosin-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains a Rosin flux. When the solder is heated, the flux is released and removes the oxide c
New Equipment | Solder Materials
KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c
New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
New Equipment | Assembly Services
100% manufacturability check prior to production IPC Class 2 specifications 100% electrical test on all boards Fully-finished PCBs with 2 solder-masks and 1 or 2 silk-screens Full finish on copper: HASL, RoHs, gold or silver . 1
General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I
1Double-sided LED circuit board Layer count: 2 Material: Chaoshun CCAF-01 aluminium base CCL Board thiness: 1.6MM Copper thiness: 1oz Min. hole size: 0.8mm Thermal conductivity: 1.0W/m-K Breakdown voltage: 4.0KV Application: LED Light
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
New Equipment | Fabrication Services
Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger Solder mask color: green Size: 125.09 x 95.25/1up SMT SMD, 230 DIP and 4 pieces component
New Equipment | Solder Materials
5N Plus produces indium in pure metal, chemical and low melting point alloy forms for use in electronics, solar cells and optics. Indium is essential in forming transparent electrodes from indium tin oxide (ITO) in liquid crystal displays (LCD) and t
