New SMT Equipment: copper (Page 4 of 27)

PCBs for High-Reliability Applications

PCBs for High-Reliability Applications

New Equipment | Assembly Services

Printed Circuit Boards ("PCBs") should be viewed as electronic real estate. Essentially, the reliability of the components that, combined with the PCB, make up your product are only as good as the foundation upon which they are assembled. The relia

Saturn Electronics Corporation

Copper Foil Composite Materia

New Equipment | Other

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t

WE GOT Electronic Co., Ltd

Copper Foil Composite Materia

New Equipment | Other

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t

WE GOT Electronic Co., Ltd

Copper Foil Composite Materia

New Equipment | Other

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t

WE GOT Electronic Co., Ltd

Copper Foil Composite Materia

New Equipment | Other

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t

WE GOT Electronic Co., Ltd

Copper Foil Composite Materia

New Equipment | Other

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t

WE GOT Electronic Co., Ltd

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/

Kapp Alloy & Wire, Inc

Research – Tin Whiskers, Copper Dissolution, Legacy

Research – Tin Whiskers, Copper Dissolution, Legacy

New Equipment | Education/Training

The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently

Rosebud Electronics Integration Corp.

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe

Kapp Alloy & Wire, Inc

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and

Kapp Alloy & Wire, Inc


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