Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...
Copper, Nickel, Silver and Graphite coatings applied to plastic enclosures
MIL-P-55110 approved for PTFE materials. Capabilities include PTFE, Thermoset materials, PTFE/FR4 hybrids, edge plating, wrap-around fingers and copper sealed vias.
Using all PTFE, Thermoset and other high performance materials, including epoxy / PTFE hybrids, edge plating and copper sealed vias.
Pan-Continental (H. K.) Limited. Fax: 886-4-26811523 Tel: 886-4-26819543 Email: pcc01@zinc.com.tw Dir Sir, 04Mar2002 Re: Copper Oxide We can offer CuO as the following spec., which suitable for electronic area expecial PCB industr
Rogers Material 1.6mm Thickness 2 Layers 1oz copper thickness Gold Plating Surface Treatment red Solder Mask e-test
Material: High Frequency Layer No.: 2 layer Board thickness: 1.60mm Copper thickness: 1 oz Finishing: Electrical Gold
FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test
Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper.
1 to 30-layer FR-4 PCBs with HDI, Aluminum based PCBs, Copper based PCBs & Iron based PCBs
