New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical m
New Equipment | Assembly Services
Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. Edge Plating can be used for a variety of
Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper.
New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp3.5™ and KappZapp4™ Silver solders to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 350°F - 500°F (176°C - 260°C). Learn m
