To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
Adhesiveless Single-Sided Copper Clad Laminate-- 2 Layer FCCL Adhesiveless Double-Sided Copper Clad Laminate-- 2 Layer FCCL FCCL-TD-W, FCCL-TD-A (Double) Product Characteristics: 1.Excellent heat resistance and chemical resistance 2.High
Composite Lithium-ion Battery Copper Foil Composite Lithium-ion Battery Copper Foil CTD-FEC is an electrolytic copper foil for lithium-ion batteries independently. Compared with traditional lithium-ion battery copper foil, composite lithium-ion bat
Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC micro line. Structure and size of copper can be custo
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
Very Low Profile Copper Film(HVLP) Very Low Profile Copper Film as Very low profile copper foil is an electrolytic copper foil. It has low surface profile, high elongation and tensile strength,high peeling strength and superior heat stability. The c
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
