New SMT Equipment: copper pad design (Page 6 of 15)

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/

Kapp Alloy & Wire, Inc

Capabilities

Capabilities

New Equipment |  

System Design • Functional specifications • Hardware/Software architecture identification • Preliminary cost estimates Engineering Design and Management

Savia Limited

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

MPP-21 Pick and Place System

MPP-21 Pick and Place System

New Equipment | Pick & Place

These systems have precise X, Y, Z and theta axis controls allowing accurate, consistent manual pick up and placement of surface mount components. This durable and easy-to-use system greatly increases efficiencies during hand assembly operations.    

DDM Novastar Inc

Kapp Golden Flux Paste

Kapp Golden Flux Paste

New Equipment | Solder Materials

Kapp Golden Flux™ PASTE has been designed specifically for soldering Aluminum to Aluminum and Copper. Kapp Golden Flux™ PASTE stays where you put it. It is designed for use on Aluminum-to-Aluminum or Aluminum-to-Copper sheets and tabs where fluxing a

Kapp Alloy & Wire, Inc

PCB prototypes

PCB prototypes

New Equipment | Components

Bicheng provides RD, high-tech, IT research companies and organizations, large or small with high quality bare PCB's PCB Products & Services * FR-4, High TG170, High CTI 600V                                   * MCPCB, 1W/mk- 3W/mk * High speed

Bicheng Enterprise Company

Fluorescent based systems

Fluorescent based systems

New Equipment |  

The phasor range of machines uses a different illumination and imaging technique and is designed for use with low contrast materials such as RTF, DSTF or double treated copper foils. phasor systems use the florescent properties of the pcb laminate to

Lloyd Doyle

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

DOCTAR - Design Object Compare Tool and Reporter

DOCTAR - Design Object Compare Tool and Reporter

New Equipment |  

DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b

cadalist-enterprises

DOCTAR - Design Object Compare Tool and Reporter

New Equipment |  

DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b

cadalist-enterprises


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