Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
New Equipment | Assembly Services
PCB process capability Base material: CM1, CM3, FR1, FR4, Metal based Layer: 1 to 24 layers Board thickness: 0.4mm to 3mm Copper thickness: 0.5oZ, 1oZ, 2oZ Min Copper thickness in hole: 0.02mm Max working size: 400*610mm Surface finishing: HAS
New Equipment | Assembly Services
Printed Circuit Boards ("PCBs") should be viewed as electronic real estate. Essentially, the reliability of the components that, combined with the PCB, make up your product are only as good as the foundation upon which they are assembled. The relia
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
With a combination of specialized processes and equipment, the boards were custom manufactured from double-sided glass-reinforced PTFE. This PCB is used for controlled impedance within a microwave application.. Utilizing advanced photolithography a
New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
Autoprocess Far East Company Ltd have been designing and manufacturing cost effective PCB manufacturing equipments for over 24 years. We carry a wild range of products, namely * Automatic Plating Equipment for pre-process and Plating from 10 sqft/
Autoprocess Far East Company Ltd have been designing and manufacturing cost effective PCB manufacturing equipments for over 24 years. We carry a wild range of products, namely * Automatic Plating Equipment for pre-process and Plating from 10 sqft/
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa
