New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
New Equipment | Cleaning Agents
KYZEN E5322 is engineered to effectively and efficiently perform off-line maintenance cleaning of your wave solder, reflow oven systems, and associated tooling. E5322 removes even the most difficult fluxes and solder pastes in commonly used immersion
New Equipment | Cleaning Agents
KYZEN E5325 is used in spray-in-air applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooli
New Equipment | Cleaning Agents
KYZEN E5321-LF is a room temperature pallet and maintenance cleaning agent specifically designed to remove flux residues from wave solder pallets, reflow oven filters, spray nozzles, air bubbling diffusion bars, and other assembly hardware used to so
New Equipment | Cleaning Agents
KYZEN E5314 is a versatile aqueous cleaning product specifically designed to remove non-reflowed solder paste from stencils and solder paste printing hardware. E5314 cleans flux from wave soldering pallets and light oils from assembly equipment and f
New Equipment | Cleaning Agents
KYZEN E5615 is an aqueous-based cleaner designed to be the fastest drying chemistry in the industry. E5615 is engineered to reduce stencil underwipe coefficient of variation and improve solder paste release. KYZEN E5615 is shipped ready to use and su
New Equipment | Cleaning Agents
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all
New Equipment | Cleaning Agents
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its
New Equipment | Cleaning Agents
MICRONOX MX2501 is an engineered precision vapor cleaning solvent designed to be a drop-in replacement for modern era vapor degreasing equipment. MX2501 is effective in removing no-clean and rosin flux residues with superior performance characteristi
New Equipment | Board Handling - Pallets,Carriers,Fixtures
PCB Component Hold Down Clamp for Pressing Components on Top Cover (Dot Clamp) Where to use: pressing PCB components on PCB board. It is fixed on Top Cover. ensure the through hole components does not leave its position during wave so
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