New SMT Equipment: cp 40 (Page 4 of 5)

AB PLC

AB PLC

New Equipment | Other

1785-L11B 1785-L20B 1785-L20C15 1785-L20E 1785-L26B 1785-L30B 1785-L40B 1785-L40C15 1785-L40E 1785-L40L 1785-L46B 1785-L46C15 1785-L60B 1785-L60L 1785-L80B 1785-L80C15 1785-L80E 1785-L86B 1785-M100 1785-ME16 1785-ME32 1785-ME64

zhengzhou yuzhe electronic technology co.,ltd

ABB 07AB200

ABB 07AB200

New Equipment | Industrial Automation

Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R

zhengzhou willing electronic technology co.,ltd

JOHNSON CONTROLS

JOHNSON CONTROLS

New Equipment | Components

PART No. 40222 42100 42102 48222 72601 72602 72603 72604 73200 73351 74501 74503 78302 02-513-123KIT 1219-13004 1219-130T4 1219-44003 1219-44003-030 1219-440B3 1219-440T3 1219-66203 1219-86203 1224-00200-004 1224-40200 190-820 246-226 246-227 246-22

zhengzhou yuzhe electronic technology co.,ltd

ABB 07AB200-CPU

New Equipment | Industrial Automation

Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R

zhengzhou yuzhe electronic technology co.,ltd

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

2510F01 FRAC HP MOTOR STARTER SW SquareD

2510F01 FRAC HP MOTOR STARTER SW SquareD

New Equipment | Components

2510F01 FRAC HP MOTOR STARTER SW SquareD 2510MBG2 Manual SquareD 2510MC03 STARTER SquareD 2936S1C27A MAGNET COIL SquareD 2NR600 TRANSFORMER SquareD 2S1F TRANSFORMER DRY 1PH 2KVA 240X480V-120/240V SquareD 30009 DOUBLE TIER RELAY SOCKET SquareD

zhengzhou yuzhe electronic technology co.,ltd

AB PLC 1485 and 2711 series

New Equipment |  

~1485G-P6N5-C 1485G-P6N5-M5 1485G-P6R5-C 1485G-P6R5-D5 1485GF-P1N5-M5 1485GF-P2N5-M5 1485GF-P3N5-M5 1485GF-P4N5-M5 1485GF-P5N5-M5 1485GF-P6N5-M5 1485K-P1F5-C 1485K-P1F5-N5 1485K-P1F5-R5 1485K-P1F5-V5 1485K-P1F5-Z5 1485K-P1FD5-D5 1485K

zhengzhou yuzhe electronic technology co.,ltd

omron relay G5A,G5V,G6A

omron relay G5A,G5V,G6A

New Equipment | Components

G5A,G5V,G6A,G6H,G6K,G6S,G6Y,G6J-Y,G6K-2F-RF,G2E,G6E,G6J,G6L,G3VM,G6Z,G6W,G4A,G4W,G4U,G5B,G5CA,G5J,G5LE,G5LC,G5N,G5PE,G5PA,G5SB,G6B,G6C,G2R,G6D,G6RN,G8P,G8N,G8ND,G8QE,G8NW,G5G,G5NB,G4B,G4F,G5RL,G2RG,G5Q,G7J,G7L,G3MB,G3MC,G3M,G3CN,G3R,G3RD,G3TB,LA,LAB,

zhengzhou yuzhe electronic technology co.,ltd

Omron PLC &CPU

Omron PLC &CPU

New Equipment | Components

CQH21 CQH210F CQH210FKU CQH32CN4R7M33 CQHC000V CQHC000V-A02 CQHC000V-A03 CQHC000VA02 CQHC000VA03 CQL 44A/D CQL-80 CQL-801 CQL806 CQL-806-20 CQL20 CQL30 CQL44AD CQL60A CQL73 CQL784 CQL7840 CQL80 CQL801 CQL806 CQL80620 CQL806D CQL845 CQMPD026 CQM1 CQM1

zhengzhou yuzhe electronic technology co.,ltd


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