New Equipment | Board Handling - Storage
Automatic Label Generation And Placement System For In-line PCB Production. PROMATION'S ELC-1100P automatic label placer is a versatile next generation system that allows for high resolution labels to be generated and placed onto circuit boards with
Specially For LED Chip Placement With Vision Centering. APP-N4-1200S is a high-speed LED surface mounting system equipped with four suction nozzles and single-cantilevered SMT head. It reaches the highest speed of 13,000 CPH. Its vision centering sy
T4 middle speed mounter used Genmany technology Product Description T4 unique feature : 1, The only one high precision pick and place machine that standardconfiguration can mount 0201 components 2, The max size of QFP:48*48mm 3, It can
High precision led strip, rgb strip 5050,5630,5730 module vision position pick and place machine Place head: double mounting head, 36 pieces sucking nozzles, 18 pieces sucking nozzles per head Min nozzle distance: 13.5MM Max PCB board size: 1200*30
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
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New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
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