适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破，HELLER推出了全新的MARK 5回流焊系列，为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗，省氮省电高达40%。因此，MK5系列不仅性能卓越，更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能，同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Ha
New Equipment | Assembly Services
Hanwha XM520 SMT Assembly Line Hanwha XM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 100000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place m
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
New Equipment | Assembly Services
Hanwha HM520 HS SMT Assembly Line Hanwha HM520 HS SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Test Equipment - Bond Testers
Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced functionality, such as automatic GR&R calculation, built-in dia
Specifications： 1、 Theoretical speed：25000 /h； 2、 Non-perform rate：less than 400PPM； 3、 Inserting direction：horizontal 0°，90°，180°，270° 4、 Lead-span：5.0mm-20mm 5、 PCB size：min.50mm*50mm，max.450mm*450mm 6、 PCB thickness：0.79-2.36mmr 7、 Applicable com
Buy Murata Capacitor from China, GRM1885C1H240JA01D Murata Chip Multilayer Ceramic Capacitors for General Purpose feature: 1.Achieves large-capacity and small size in a multilayer structure. 2.Sn plating is applied to the external electrodes
