New Equipment | Test Equipment
Improve both board test coverage and test throughput at in-circuit test with i3070 and i1000D ICT systems that offer one of the best ROICs available in the market today. The Medalist i3070, the next generation In-Circuit Test System, enables 20% mo
The only portable reflow oven optimizers with statistical process control (SPC). Regardless of the recipe and what your reflow oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANT
MODEL NAME: HP-350MD ; HP-620MD Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various PCB Clamping options depend
MODEL NAME :HPX-1300S - LED Screen Printer with 2D Inspection Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Variou
Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens
SCALABLE, COST-EFFECTIVE SOLUTION FOR HIGH-MIX & NPI Combines the capability, flexibility, and reliability you expect from Panasonic’s award-winning NPM and PanaCIM® Manufacturing Execution System (MES) into a cost-effective, high-mix solution. T
Realizes the Highest Placement Speed Among Chip Shooters of the Same Class by Adopting a New Flying Head Mechanism Equipped With 10 Spindles. As a high performance chip shooter that applies two gantries equipped with 10 spindles per head as well as
New Equipment | Test Equipment
The Agilent Medalist i1000 in-circuit test (ICT) system is a low-cost in-circuit test solution which now comes with digital testing capabilities while maintaining its original low-cost fixture solution. The Medalist i1000 in-circuit test (ICT) syst
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is e
