Measure machine Cp & Cpk data, analyze statistical placement accuracy, identify mechanical issues. With the competitive environment facing our industry, the SMT machine replacement cycle has clearly slowed. Many companies want to keep their old equi
Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual chamber machines. Get more out of
2 Cpk @ +/-25 microns 6-Sigma INQUIRY DEK Stencil Printer Horizon 8 Specifications: DEK’s Horizon platforms offer a comprehensive array of sophisticated features as standard, including optimised printer frame technology, fast product chang
Heller 1809 Mark III Vacuum Reflow Oven SMT Reflow Oven Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Product description: Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Specifications: NITROGEN
Heller 1809 Mark III Vacuum Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Product description: Heller 1809 Mark III Vacuum Reflow Oven INQUIRY Heller 1809 Mark III Vacu
Heller 1809 Mark III Vacuum Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Product description: Heller 1809 Mark III Vacuum Reflow Oven INQUIRY Heller 1809 Mark III Vacu
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
Heller 1809 Mark III Vacuum Reflow Oven 9 Heated Zones 2 Cooling Zones Nitrogen process Product description: Heller 1809 Mark III Vacuum Reflow Oven, 9 Heated Zones, 2 Cooling Zones, Nitrogen process Heller 1809 Mark III Vacuum Reflow Oven Pr
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
