New SMT Equipment: cpk process (Page 5 of 30)

DEK Stencil Printer Horizon 8

DEK Stencil Printer Horizon 8

New Equipment | Printing

2 Cpk @ +/-25 microns 6-Sigma  INQUIRY DEK Stencil Printer Horizon 8 Specifications: DEK’s Horizon platforms offer a comprehensive array of sophisticated features as standard, including optimised printer frame technology, fast product chang

Fomyn Equipment co,.ltd

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven SMT Reflow Oven Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Product description: Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Specifications: NITROGEN

Flasonsmt Co.,ltd

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Product description: Heller 1809 Mark III Vacuum Reflow Oven  INQUIRY Heller 1809 Mark III Vacu

Flasonsmt Co.,ltd

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Product description: Heller 1809 Mark III Vacuum Reflow Oven  INQUIRY Heller 1809 Mark III Vacu

Flason Electronic Co.,limited

Automatic Screen Printer

Automatic Screen Printer

New Equipment | Solder Paste Stencils

DESEN Classic 1008  SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum

Shenzhen Gosmt Technology Co., Ltd

Automatic Screen Printer

Automatic Screen Printer

New Equipment | Solder Paste Stencils

DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6

Shenzhen Gosmt Technology Co., Ltd

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven 9 Heated Zones 2 Cooling Zones Nitrogen process Product description: Heller 1809 Mark III Vacuum Reflow Oven, 9 Heated Zones, 2 Cooling Zones, Nitrogen process Heller 1809 Mark III Vacuum Reflow Oven Pr

Flasonsmt Co.,ltd

Automatic Screen Printer

Automatic Screen Printer

New Equipment | Solder Paste Stencils

DESEN Hito  SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm

Shenzhen Gosmt Technology Co., Ltd

Automatic solder paste printer machine for 1200mm PCB

Automatic solder paste printer machine for 1200mm PCB

New Equipment | Printing

Automatic solder paste printer machine for 1200mm PCB Description: LK-F1200 Ideal for LED production which for Accuracy it has built-in ±10 micron alignment,and ±25 micron wet print repeatability (≧2.0Cpk@6sigma) with 20 seconds total throughpu

Langke Automation Equipment(smdmachine.com)

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven SMT Reflow Oven Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Product description: Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Specifications: NITROGEN S

Flasonsmt Co.,ltd


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