New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS+ 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 25mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
