New SMT Equipment: crafted (Page 1 of 33)

Small Run Prototype Assembly Services

Small Run Prototype Assembly Services

New Equipment | Prototyping

Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy

ACI Technologies, Inc.

ESD Belt Conveyor With Workbench For Assembly | SZTech-SMT

ESD Belt Conveyor With Workbench For Assembly | SZTech-SMT

New Equipment | Board Handling - Conveyors

ESD Belt Conveyor With Workbench For Assembly from SZTech-SMT. All sizes and materials of it are customizable. It can be placed after wave out feed soldering conveyor. Below is a simple drawing for your reference! ALL SIZES ARE CUSTOMIZABLE!! Main

SZTech-SMT Firm

RTP 3019/00 SER 3000 I/O MODULE New Original

RTP 3019/00 SER 3000 I/O MODULE New Original

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

07KT94 GJR5252100R3261

07KT94 GJR5252100R3261

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

6 layer heavy ENIG board

6 layer heavy ENIG board

New Equipment | Prototyping

Project Description | Parameters 6 Layer  Thickness: 1.8+/-0.18 mm Min Hole Size: 0.25 mm Width/Space: 0.2mm/0.2 mm Surface Treatment: ENIG | Craft Gold Finger 5U" Thick Au | Application Telecommunication

Headpcb

Immersion silver PCB

Immersion silver PCB

New Equipment | Prototyping

Project Description | Parameters 2 Layer Thickness: 0.6+/-0.1 mm Min Hole Size: 0.5 mm Width/Space: 0.3mm/0.3 mm Surface Treatment: Immersion Silver | Craft Immersion Silver | Application Consumer Electronics

Headpcb

Golden Finger PCB

Golden Finger PCB

New Equipment | Fabrication Services

Project Description | Parameters 10 Layer  Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+Gold Finger | Craft Red Ink Gold Finger | Application Industrila Control

Headpcb

Ceramic Base Board

Ceramic Base Board

New Equipment | Prototyping

Project Description  | Parameters 2 Layer Thickness: 0.63+/-0.06 mm Min Hole Size: 0.4 mm Width/Space: 0.16mm/0.13 mm Surface Treatment: ENIG | Craft Ceramic Wafer | Application Communication

Headpcb

Back Plane Board

Back Plane Board

New Equipment | Prototyping

Project Description | Parameters 32 Layer  Thickness: 6.2+/-0.62 mm Size: 870*540mm Min Hole Size: Via: 0.65 mm  Width/Space: 0.1mm/0.15 mm Surface Treatment: ENIG | Craft 32 Layer Unsymmetrical Layup Strcture | Application Base Station

Headpcb

High Thermal Conductivity Heavy Copper Board

High Thermal Conductivity Heavy Copper Board

New Equipment | Prototyping

Project Description  | Parameters 16 Layer  Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Material: SY ST115 Thermal Conductive:1.5W/m.k Back drilling, laser drilling | Application Electronic Power 

Headpcb

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