The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Automobile mechanical parts coating , cell phone buttons point glue , mobile phone battery packaging,laptop battery packaging , the coil point glue , PCB bonding / sealing , IC bonding / sealing , horn external punctuate glue , PDA sealing , LCD
Semi Automatic Manual Liquid Dispenser Machine For Mobile Screen Automobile mechanical parts coating, cell phone buttons point glue, mobile phone battery packaging,laptop battery packaging, the coil point glue, PCB bonding/ sealing, IC bonding/
Features: Apply to Korea rolling high-speed guide-rail and scraper, which derived by frequency conversion variable speeds motor, in order to make sure printing precision. Scraper can slide back and forth to choose printing position. Honey
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
New Equipment | Solder Materials
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils and related products in the industry. Fine Line Stencils highly-polished PrintMaster and Slic-Blade nickel squeegee blades offer impro
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a
VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an op
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
