New SMT Equipment: cross section polishing equipment (Page 1 of 2)

SawPolish Unit (SPU 60) - Sawing & Polishing Unit for Crimp Cross Section Analysis

SawPolish Unit (SPU 60) - Sawing & Polishing Unit for Crimp Cross Section Analysis

New Equipment | Cable & Wire Harness Equipment

Overview The SPU 60 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Excellent cutting surface Sawing & polishing in one working step

Schleuniger, Inc.

SawInspect System 6 (SIS 6) - Compact Sawing and Inspection System for Crimp Cross Section Analysis

SawInspect System 6 (SIS 6) - Compact Sawing and Inspection System for Crimp Cross Section Analysis

New Equipment | Cable & Wire Harness Equipment

Overview The SawInspect System 6 (SIS 6) is an innovative new product that provides crimp quality assurance and quality control to the wire processing industry. This extremely compact sawing and inspection system is used to quickly create and analyz

Schleuniger, Inc.

SawPolish Unit (SPU 6) - Sawing & Polishing Unit for Crimp Cross Section Analysis

SawPolish Unit (SPU 6) - Sawing & Polishing Unit for Crimp Cross Section Analysis

New Equipment | Cable & Wire Harness Equipment

Overview The SPU 6 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Very simple handling Efficient and quick cleaning Cleaning directl

Schleuniger, Inc.

MicroGraph System - Modular System for Crimp Cross Section Analysis

MicroGraph System - Modular System for Crimp Cross Section Analysis

New Equipment | Cable & Wire Harness Equipment

Overview Schleuniger’s MicroGraph System allows the creation of high-quality crimp cross-sectional images in a fraction of the time needed with “conventional” methods. The system is comprised of modular components that can be combined according to

Schleuniger, Inc.

ElectrolyteStaining Unit (ESU) - Sample Staining Unit for Crimp Cross Section Analysis

ElectrolyteStaining Unit (ESU) - Sample Staining Unit for Crimp Cross Section Analysis

New Equipment | Cable & Wire Harness Equipment

Overview The ESU 6 ElectrolyteStaining Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Very simple handling Efficient and quick cleaning Cleaning dir

Schleuniger, Inc.

Squeegee Blades

Squeegee Blades

New Equipment | Solder Materials

Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils and related products in the industry.   Fine Line Stencils highly-polished PrintMaster and Slic-Blade nickel squeegee blades offer impro

FCT ASSEMBLY, INC.

Multilayer Mixed Dielectric PCB

Multilayer Mixed Dielectric PCB

New Equipment | Components

Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry.  Multilayer Mixed Dielectric PCB Specifications:

Standard Printed Circuits, Inc.

Multilayer High Frequency Coupler

Multilayer High Frequency Coupler

New Equipment | Components

This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with

Standard Printed Circuits, Inc.

CableCoiler 4000 - Coiling Machine

CableCoiler 4000 - Coiling Machine

New Equipment | Cable & Wire Harness Equipment

Overview The CableCoiler 4000 is a motorized heavy-duty cable coiling machine designed to interface with the MegaStrip 9600. It coils cable up to an inner diameter of 600 mm (23.6") and handles cable coils weighing up to 80 kg (178 lbs.) Processi

Schleuniger, Inc.

3D Master 3000 neo / wide - Table Top SPI System

3D Master 3000 neo / wide - Table Top SPI System

New Equipment | Inspection

Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens

Synapse Imaging Co., Ltd.

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