New SMT Equipment: cu clad laminators (Page 1 of 2)

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l

Hitech Circuits Co., Limited

IPC Market Research

IPC Market Research

New Equipment | Education/Training

The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex

Association Connecting Electronics Industries (IPC)

IPC Standards

IPC Standards

New Equipment | Education/Training

IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics

Association Connecting Electronics Industries (IPC)

DUPONT™ - High Performance PCB Laminates (HPL)

DUPONT™ - High Performance PCB Laminates (HPL)

New Equipment | Materials

Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m

INSULECTRO

Laminates

Laminates

New Equipment |  

We can supply Copper Clad Laminates used in manufacture of Printed Circuit Boards meeting international standards from India. Laminate Types : CEM1, CEM3, FR1, FR2, FR3, FR4 and Flexible. Thickness : 0.2 mm - 6.0 mm Copper Cladding : 1

3Wi Technologies

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Copper Foils

Copper Foils

New Equipment |  

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and

Oak Mitsui Inc.

Printed Circuits

Printed Circuits

New Equipment |  

Printed Circuit Boards meeting international standards are available from Indian Printed Circuit Board manufacturer. Complete range of UL approved products : Base Laminate : CEM1 , CEM3, FR3, FR4 and FR1, FR2, Flexible. Thickness

3Wi Technologies

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cu clad laminators searches for Companies, Equipment, Machines, Suppliers & Information

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