New Equipment | Curing Equipment
Designed for Conformal Coatings and other Curing applications. LEL Protection. High Solvents, High Solids, Humidity Curing. High Volume Production. Large Area Filters. Reel to Reel Foil Drip liner and removable drip pans for easy maintenance. Convect
Conveyor reflow oven with 50" (1270mm) long heating tunnel for low to medium volume surface mount assembly. Four (4) heating zone reflow oven with 18" (457mm) wide conveyor for production runs utilizing our patented Horizontal Convection Heating te
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
New Equipment | Solder Paste Stencils
right ( or Right -> left ) Transport Band Height 880±20mm Transport Method Net band Transport Velocity 0-1500mm/min Control System Voltage
Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Conveniently view and share profiles on mobile devices Software Description Auto-Focus Power™ is a ‘recipe search engine’ with an intelligent database Every manual profile will populate the database. The correlations between the oven properties,
Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/H
A continuous motion feeder system used for the separation and transfer of needles into syringe hubs. The syringes are then transferred ready for UV or epoxy adhesive application, curing and inspection. Technical Info: Typical line speed up to 1,000
Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable,
Used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-SL-HT is capable of lead and lead free, high temperature applications, with a programmable, digital controller for
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