Lead Free SMT Reflow Oven XMR-1000D Product features: ▶fully meet all kinds of lead-free welding process requirements. ▶WindowsXP operating system, English and Chinese interface, easy to learn operation; Standard air furnace, patented hot air system
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS+ 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 25mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Soldering Robots
The absolute best vaule in today's marketplace. Save thousands. What is a robotic soldering solution? A Soldering Robot is a fully automated system that performs a designated task set by a custom program with the utmost precision and repeatability.
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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
New Equipment | Wave Soldering
Maximum flexibility and performance - state of the art full tunnel nitrogen wave soldering system for demanding applications and high production volumes. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the m
