New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
SMARTLine™ is a state-of-the-art data capture system that builds upon Solderstar’s range of real-time process monitoring instruments and sensors. The new interfaces provide the network link and software for streaming of live process data from the ove
New Equipment | Test Equipment
A tough, portable monitor with a full performance spectrum analyzer and digital oscilloscope, the COM-120B combines over 20 instruments into one unit, the versatile COM-120B offers a cost effective alternative to higher cost test sets. Unique Split
New Generation of Video Microscope for High Quality and Reliable Visual Inspection of solder joints of BGA, uBGA, CSP and Flip-Chip packages. Connecting it to your PC or Laptop to utilize benefits of Digital Image Capture, Measurements and Data Manag
MobilEye develops driving assistance systems based on a single video camera. As a result, there is no need for multiple cameras calibration and synchronization. The novel video analysis algorithms achieve unmatched performance in poor lighting, rain
New Equipment | Test Equipment
The Agilent http://www.recontest.com/index.php?main_page=product_info&cPath=112_118&products_id=1836offers solid logic analyzer performance at an attractive price. Deep memory options let you capture more data and save you from having to set up com
New Equipment | Test Equipment
The Agilent 1673G offers solid logic analyzer performance at an attractive price. Deep memory options let you capture more data and save you from having to set up complex triggers. The integrated oscilloscope option lets you view analog and digital
This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
New Equipment | Wave Soldering
The SolderStar WaveShuttle PRO is a wave optimizer that quickly allows you to analyse, improve and gain control of your wave soldering process. This unique fixture incorporates two measurement systems to give the most comprehensive and repeatable mea
Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection
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