New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
If you have only Gerber data files to work with then ProntoGERBER-CONNECTION can help you! ProntoGERBER-CONNECTION imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and create process assembly
ProntoTEST-FIXTURE used by electronics manufacturers will accurately setup your Automatic Test Equipment (ATE), Flying Probe and design your "bed of nails" test fixturing. In minutes Unisoft ProntoTEST-FIXTURE software translates CAD and Bill of Ma
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
New Equipment | Test Equipment
KIC start Thermal Profiler with 6 Channels for Reflow Oven 6 channels KIC start Thermal Profiler usage: reflow oven thermal profiler Product description: KIC start Thermal Profiler with 6 Channels for Reflow Oven INQUIRY KIC star
KIC start Thermal Profiler with 6 Channels for Reflow Oven Thermal Profiler with 6 Channels for Reflow Oven Thermal Profiler for Reflow Oven 6 channels KIC start Thermal Profiler usage: reflow oven thermal profiler Product description: KIC
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
The depaneling process of this model is operated only in Y-direction. Can be equipped with differing cutting fixtures. It should be noted here, that the PCB panel is processed in Routing Spindle. The routing spindle is mounted onto a Y- linear-axi
