New SMT Equipment: datacon die bonder (Page 1 of 2)

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Eclipse Industries

New Equipment |  

Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of

Eclipse Industries

Precision tools

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

New Equipment | IC Packaging

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon

Finetech

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

HYBRID/MCM DESIGNER

HYBRID/MCM DESIGNER

New Equipment |  

This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal

CAD Design Software

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

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