SUPERIOR VISION 6000 � UNRIVALED SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 6000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs,
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
New Equipment | Design Services
PollEx PCB DFM PollEx DFM is rule-based PCB verification software for manufacturing engineers. Using PollEx PCB as its basis PollEx DFM supports PCB design data in various ECAD formats. It allows users to detect design errors which result in costl
Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib
eM-Quality System is a powerful, integrated shop-floor data collection and analysis tool that empowers you to improve yields and reduce defects in real-time. eM-Quality System 2.1 provides real time information on product yield, centralized collectio
Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
The need for automatic optical inspection (AOI) in the SMT assembly industry is clear. Increasing miniaturisation and placement densities mean that only an AOI system can reliably detect all types of solder defects at line speeds and at a reasonable
For devices which fail lead inspection, we also offer equipment that can correct pin to pin as well as standoff and coplanarity defects.
Through a unique design, the WS-2000 provides both bump metrology measurement and defect detection using a powerful combination of 2-D and 3-D inspection technologies.
