1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be
PollEx Products: PollEx PCB – Viewing of ECAD design data PollEx CP (Cross Probe) – Comparing 3 points & revised design data PollEx Logic – Viewing of schematic data PollEx BOM – Easy matching BOM data from any format PollEx CAM
New Equipment | Design Services
PollEx PCB DFE PollEx DFE is rule-based PCB verification software for electrical engineers. It consists of Pre-Processor, Running Core, and Post-Processor. Pre-Processor is used for setting input parameters. Users can define rules or classify and
One of three Interactive CD-ROMs developed for Soldertec Global by Bob Willis to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a ste
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
New Equipment | Solder Materials
AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j
The system features high clearance for assemblies with up to 300mm height. Main application is the foil and PTH inspection. X-ray system features Inspection program control system with automatic defect detection and defect verification capability
The LS-7700 is the only end-of-line package inspection system that offers measurement of all JEDEC-specified mechanical parameters, mark inspection and defect detection over the entire range of all devices - including leaded, leadless and grid array.
The RTI-6500 and RTI-6520 area high-speed, cost-effective vision-based automated PCB inspection systems for verifying component presence, correct part, orientation, polarity, and solder defects providing yield improvement solutions for the printed ci
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