The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
Vantage™ S22 Plus is a cost-effective solution that delivers top-of-the-line AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT / PTH environments. DPIX™ 3-D Technology
New Equipment | Test Equipment
Reliable high-quality, high-volume testing for the latest printed circuit board assembly (PCBA) technologies. TestStation in-circuit test systems provide full structural and functional coverage for a wide range of manufacturing, component, process,
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production
The CmController is a system incorporating a highly accurate mechanical measurement system that is powered by a statistical, algorithm driven software backbone. The basis of the evaluation is to determine machine and process capability. ************
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
At ELECTRONIC TEST CENTER, we understand the importance of accurate, dependable testing. That's why we provide board test results that you can count on! When we say that a board has passed testing, you can ship it with confidence, and when we say a
New Equipment | Solder Paste Stencils
Stentech has its very own high quality stencil rolls, designed for use in SMT (Surface Mount Technology) and screen printing lines. These rolls are designed to keep stencil apertures clear of paste residues during the automatic screen printing proces
3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive
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