New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
SemiPack's capabilities range from fully automatic to manual processing; extensive cropping and forming capabilities; active and passive component processing; axial to radial lead forming servicing; and snap-in and stand-off forms. For SMT processi
Customers have long relied on Kuchera's substantial expertise in build-to-print programs. In addition, our strong computer aided design capabilities are frequently employed to enhance product functionality. Kuchera is dedicated to providing highly r
New Equipment | Tape and Reel Services
Over 25 years of SMD Taping Experience. Tape and Reel, is what we do, it is not a sideline, it is our core business. Mid America has a capacity of over 1 million parts per day, on a variety of equipment from all the leading manufacturers, both manua
New Equipment | Rework & Repair Services
STI has qualified technicians trained in IPC 7711/7721, as well as in custom design solutions, to address your electronic rework and repair needs. STI’s services encompass both mainstream assembly technologies (surface mount and through-hole) as well
Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection
New Equipment | Tape and Reel Services
Capabilities include capacitors, resistors, thermistors, LEDs, TO92 transistors, TO220s. Orders can be processed with standard lead space configuration (increments of .100" or 2.54mm) or with custom or non-standard lead space configurations with ree
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
