2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
New Equipment | Assembly Services
Hanwha HM520 MF SMT Assembly Line Hanwha HM520 MF SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
New Equipment | Assembly Services
Hanwha HM520 HS SMT Assembly Line Hanwha HM520 HS SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Galaxy, from DEK redefines the upper performance limit for high accuracy mass imaging platforms. Featuring the new high-tech DEK user interface; it's highly graphical, including the new TimeToGo "feedback gauges" showing remaining paper, paste and so
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
G 5003 - LR Ink Mixer and Defoamer (Air Bubble Remover) R&D for Best Mixing Solution: Ink for Printed Circuit Boards, AB paste and Ag (Silver) paste mixing and defoaming solution. Great use for: PCB Factory, Glass Panel Factory, Photoelectric Ind
