Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
FKN Systek K5000 - Manual board feed PCB multiple panel singulation Singulate panels with up to 10 scorelines. Singulate panels with components up to 2.5" 3 models available: - Output tray - Straight output conveyor - Right angle output
Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a
Galaxy, from DEK redefines the upper performance limit for high accuracy mass imaging platforms. Featuring the new high-tech DEK user interface; it's highly graphical, including the new TimeToGo "feedback gauges" showing remaining paper, paste and so
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
Line Set-up Control ensures the automatic validation of feeders, reels and other materials on the SMT line, and at other assembly operations such as through-hole and final assembly. It validates that all materials are in the right place at the right
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
