When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Very great to meet you right here and wish you will have a good day. Since 1997 we have been manufacturing and exporting electronics connectors for OEM/ODM projects.For our expertise and professional,that's why famours companies come to us,like Tyc
We kingwin is an ISO9001:2000 and UL certified OEM manufacturer specializing in high-quality PCBs. Our capabilities cover: - Rigid printed circuit: single, double μlti-layer-Flexible printed circuit- Both prototype and mass production available Our p
We kingwin is an ISO9001:2000 and UL certified OEM manufacturer specializing in high-quality PCBs. Our capabilities cover: - Rigid printed circuit: single, double μlti-layer-Flexible printed circuit- Both prototype and mass production available Our p
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
Gold finger PCB/Impedance computer circuit board Layer:6 Thiness: 2.0mm Surface treatment: ENIG+Hard gold plated on gold finger Impdance control: Single-ended 50ohm, differential 90 ohm Application: Computer
