New SMT Equipment: delaminate (Page 1 of 3)

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Precision Material Removal System (PMRS)

Precision Material Removal System (PMRS)

New Equipment | Cleaning Equipment

WHAT IS THE PRECISION MATERIAL REMOVAL SYSTEM™ (PMRS)?  The Precision Material Removal System (PMRS) is a multi-faceted system designed to be effectively used in three different applications:  1/ Conformal coating removal     2/   PCB Delamination  

ScanCAD International, Inc.

Epoxy Kit

Epoxy Kit

New Equipment | Coating Materials

This kit contains 10 packages of clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring. Once cured, this epoxy makes an effective electrical insulator

Circuit Technology Center, Inc.

PC Board Product Assurance Testing

PC Board Product Assurance Testing

New Equipment | Test Equipment

Military-style laboratory services to validate bare boards for product assurance. Testing for delamination, voids, copper thickness, hole quality, proper stack-up, etc. Customer receives all cross-section pucks, boards and laboratory report with reco

DIVSYS International-ICAPE, LLC

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Adhesion Promotion Treatments

Adhesion Promotion Treatments

New Equipment | Materials

Adhesion Promotion Electronics Coatings Increase the bond strength, eliminate delamination, and improve reliability of difficult to bond substrates. Aculon's non-stick, adhesion promotion and anti-oxidation coatings can be used on a broad range of

Aculon

NanoClear® - Stencil Wipes

NanoClear® - Stencil Wipes

New Equipment | ESD Control Supplies

High performance fluxophobic stencil treatments wipes Enhance your stencil performance in seconds! Aculon is pleased to announce the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the undersi

Aculon

Lite Fast 2081

Lite Fast 2081

New Equipment |  

Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant

MLT/Micro-Lite Technology

FX-UV AOI - Automated Conformal Coat Inspection

FX-UV AOI - Automated Conformal Coat Inspection

New Equipment | Inspection

Full size automated conformal coat inspection. Quick set-up with Auto Train™ 5 megapixel color imaging Proprietary Lighting Optional side angle cameras Conformal coatings used by electronic manufacturers contain UV indicators for

Nordson YESTECH

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